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Samsuing Preps For Mass Production On Next-Gen HBM4 Memory in 2026: 24Gb GDDR7, And 128GB+ DDR5 Products In The Plans Too

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Samsung is also set to begin production of next-gen HBM4 memory, 24 Gb GDDR7 DRAM & 128 GB+ products in 2026.
Samsung is also set to begin production of next-gen HBM4 memory, 24 Gb GDDR7 DRAM & 128 GB+ products in 2026.Samsung All Set To Enter Mass Production on Next-Gen Memory Products Including Stable Supply of 2nm GAA Process In 2026
Samsung has announced its Q3 2025 earnings report, highlighting a 15.4% increase in revenue versus the previous quarter. The South Korean technology company posted a revenue of KRW 86.1 trillion, and also set an all-time high from quarterly sales for its Memory business, mainly driven by strong demand for its HBM3E memory and server SSDs, thanks to heightened AI momentum.
Just recently, Samsung showcased its next-gen HBM4 memory solution for the first time. Offering speeds of up to 11 Gbps per IC, the next-gen solution will be a potential solution for upcoming AI accelerators by NVIDIA and AMD, such as Rubin and MI400 series. Samsung is likely to have sent out samples of its HBM solutions to AI chip makers for further evaluation and qualification testing.
In addition to this, Samsung is also looking to provide a stable supply of 2nm GAA (Gate-All-Around) production & the HBM4 base die in 2026. The 2nm process from Samsung is likely going to be used for the production of the next-gen Exynos SoC / Qualcomm Snapdragon SoCs and will enter ramp this quarter.

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