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LG G7 ThinQ Launch Set for May 2, Company Confirms Name

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LG G7 ThinQ, the South Korean electronic giant’s upcoming flagship, has been leaked in its entirety in all available colours of the handset.
LG G7 ThinQ, the South Korean electronic giant’s upcoming flagship, has been leaked in its entirety in all available colours of the handset. According to the leak, the smartphone will arrive with the famous iPhone X -like notch along with an edge-to-edge display. It is said to be made available in Raspberry Rose, Moroccan Blue, Moroccan Blue (Matte), Platinum Grey, and Aurora Black colour variants – availability to vary depending on region and carrier. However, Aurora Black might be available by default in all regions. Additionally, LG has also confirmed the naming and launch date for the LG G7 ThinQ.
AndroidHeadlines has reportedly obtained an exclusive look at press renders of the upcoming LG G7 ThinQ, which is due to launch later this year. On the back of the handset, one can spot a new vertical dual camera setup, an LED flash, a rear-mounted fingerprint sensor, and standard LG branding (without the G7 brand name). On the right, there is a single lock button; on the left is the volume control and an extra button – possibly for activating a virtual assistant.
Separately, LG has announced that it will unveil the LG G7 ThinQ at a launch event slated for May 2 in New York, followed by a South Korean launch in Seoul on May 3. While the company did not reveal much, it did state the phone would feature certain AI capabilities.
A previous report suggests that this might be LG’s first smartphone to sport an f/1.5 aperture to offer enhanced photography and videography in low light conditions. Apart from that, the LG G7 ThinQ is claimed to be powered by a Qualcomm Snapdragon 845 SoC, coupled with 6GB of RAM and 64GB of inbuilt storage.
Just recently, LG unveiled its latest V30S ThinQ and V30S+ ThinQ ahead of the 2018 edition of Mobile World Congress in Barcelona. Both smartphones come with similar specifications, albeit with differences in inbuilt storage and RAM capacity.
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