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Thin for the Win: Qualcomm Shows Wafer-Slim, Fanless Desktop PCs Powered by New Snapdragon X2 Chips

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Two nifty, super-slim reference design (one shaped like a saucer!) surface at Snapdragon Summit 2025, powered by new Snapdragon X2 Elite chips and cooled by buzzy tech from thermal pioneer AirJet.
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MAUI—At Snapdrgon Summit 2025, Qualcomm’s annual gathering to showcase its upcoming technologies, the chip maker showed off a host of reference designs for its new Snapdragon X2 Elite and Elite Extreme chips. Laptops of several screen sizes and a detachable tablet were part of the expected mix, but the most eye-opening was a pair of desktops in form factors we’ve not seen before. Anyone for a coffee-cup heater, or a skinny, modular AIO snap-in desktop?No, Not a Mug Warmer: Meet the Saucer-Sized Snapdragon Desktop
No, the circular model isn’t going to keep your java warm. But initial impressions of the disc-shaped, super-thin desktop on display ranged from mug warmer to wireless phone charger. It’s neither, but it’s a rare desktop without sharp or rounded covers; it’s all one rounded corner. We’ve seen no shortage of cylinder PCs over the years, but imagine this like a thin slice of a model like the MSI Vortex.
Whether we’ll ever see the circular model in a commercial or consumer product is up for debate. But the machine was running a Snapdragon X2 Elite series chip and powering a full-size monitor over USB-C/DisplayPort Alt Mode. It’s less than half an inch thick and just a smidge larger than a teacup saucer.
Around the edges, I noted a small smattering of USB-C (one being used as the power feed) and a headphone jack.

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