A new laser-based technique developed by a team of Japanese scientists from Chiba University seemingly provides a way to “effortlessly slice” diamonds along the optimal crystallographic plane.
In context: Diamonds are among the most promising materials for tech applications, such as fast telecommunications and power conversion in electric vehicles or power plants. However, diamonds aren’t easy to work with, as they tend to crack when trying to cut wafers out of them.
A new laser-based technique developed by a team of Japanese scientists from Chiba University seemingly provides a way to “effortlessly slice” diamonds along the optimal crystallographic plane. The research was recently published in the journal Diamond and Related Materials, and it could assist the semiconductor industry in adopting one of the sturdiest materials known to man.
Diamonds have attractive properties for semiconductor applications, the researchers said, as they have a wider bandgap than silicon. They could theoretically be employed to create more efficient semiconductors, capable of working at higher voltages, frequencies, and temperatures.
