During an event it called “Architecture Day” this week, Intel prepared us for what’s coming up in 2019. The company had a lot of announcements to make, and one
During an event it called “Architecture Day” this week, Intel prepared us for what’s coming up in 2019. The company had a lot of announcements to make, and one of the most exciting is a new 3D packaging method for CPUs that it’s calling Foveros. Beyond Foveros, we also heard some impressive claims about next generation integrated graphics and, of course, we received a codename for its next CPU architecture.
“Foveros paves the way for devices and systems combining high-performance, high-density and low-power silicon process technologies,” Intel said in a statement today. As the company describes it, Foveros will be a way for designers to stack various IP blocks on top of one another.
