Renowned Apple analyst Ming-Chi Kuo has now revealed that the next-generation AirPods will adopt a more advanced SiP or system-in-package chip …
Renowned Apple analyst Ming-Chi Kuo has now revealed that the next-generation AirPods will adopt a more advanced SiP or system-in-package chip technology instead of the current SMT or surface mount technology.
The SiP tech allows for more components to be packed inside a smaller space, which is similar to the AirPods Pro.
The AirPods pro uses SiP and the custom H1 chip handles noise-cancellation, Siri commands, connectivity, etc.
