The 3D V-Cache shown off by AMD at Computex is the (relatively) simple addition of further L3 cache to a Ryzen 9 5900X, bringing around a ~15%…
Forward-looking: 3D chip stacking technology has yet to arrive in a big way, with only Intel Foveros reaching the market in Lakefield CPUs, and some Zen3-with-vertically-stacked-cache products waiting in the wings. But at this year’s Hot Chips symposium, AMD is already laying out where it intends to go from here, with ambitious ideas on how to apply the technology. The 3D V-Cache shown off by AMD at Computex is the (relatively) simple addition of further L3 cache to a Ryzen 9 5900X, bringing around a ~15% performance uplift in games. The 3D-stacking arrangement let AMD use a production process that allows for more densely packed SRAM for the upper die, fitting 64 MB in the space directly above the 32 MB on the base die that had to be silicon suitable for both cache and compute.
