Both the Snapdragon 8 Gen 4 and Dimensity 9400 are rumored to be fabricated on TSMC’s 3nm manufacturing process
Qualcomm and MediaTek might be a generation behind Apple when using TSMC’s cutting-edge technology for mobile chipsets, but next year, both companies are rumored to close the gap when they officially announce the Snapdragon 8 Gen 4 and Dimensity 9400. One tipster claims that both SoCs will use TSMC’s 3nm process, and as usual, he leaves out some of the more important details.Tipster claims the Dimensity 9400 is ‘restrained,’ while the Snapdragon 8 Gen 4 will feature Qualcomm’s custom cores
Before talking about next year’s Snapdragon 8 Gen 4 and Dimensity 9400, tipster Digital Chat Station talks about the newly announced chipsets, the Snapdragon 8 Gen 3 and the ‘soon to be unveiled’ Dimensity 9300.
