The Dimensity 9400 is not just arriving in the fourth quarter of 2024, but the MediaTek CEO says it will launch with AI capabilities
The Dimensity 9400 will be MediaTek’s first 3nm chipset that is said to take advantage of TSMC’s second-generation lithography, resulting in increased power efficiency and other benefits. As for when the SoC gets an official unveiling, the company CEO Rick Tsai stated that it will arrive in the fourth quarter of the year with boosted AI capabilities to rival other high-end smartphone chips. Alongside the Dimensity 9400, we should see Qualcomm’s Snapdragon 8 Gen 4 in action, which is also said to be mass produced on TSMC’s advanced 3nm process.Dimensity 9400 to adopt the same CPU cluster as Dimensity 9300 with no efficiency cores; advanced 3nm process should help with power draw
While no performance comparison was provided by MediaTek’s CEO, a China Times report states that the Dimensity 9400 will arrive with improved AI capabilities.
