In February, China’s researchers successfully bonded an 8-inch silicon photonics wafer with a lithium niobate wafer.
Researchers at the JFS Laboratory in Wuhan, China have achieved a breakthrough in the development of high-performance photonic devices. Their innovation is a cost-effective chip that simplifies the manufacturing process for these devices.This chip can simplify 5G communication, aerospace engineering and more
The key to this advancement lies in a technique called wafer bonding.
