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MediaTek’s new Dimensity 6300 to power next wave of affordable 5G smartphones

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MediaTek has launched its latest new SoC, Dimensity 6300 that will power next-generation og affordable 5G smartphones like Realme C65 5G.
MediaTek is wading into the crowded mid-range market with the Dimensity 6300, a new chipset aimed at powering the next wave of affordable 5G smartphones.
The chip is manufactured on a 6nm process and offers a modest upgrade over its predecessor, the Dimensity 6100+. MediaTek says a 10% bump in CPU performance thanks to two faster Cortex-A76 cores clocked at 2.4GHz. The remaining six cores are Cortex-A55 clocked at 2GHz.

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