The competition to produce the world’s most advanced chips is fierce, and TSMC’s product roadmap promises that the battle for supremacy will be intense. First, its performance-optimized.
Forward-looking: TSMC has scheduled its performance-optimized N3P node to enter mass production in the second half of 2024, but it’s not too soon to see what else the chipmaker has in store for the future. N3X, N2, N2P and A16 nodes, are coming in 2025 and 2026, bringing different strengths to the market, such as TSMC’s first use of gate-all-around (GAA) nanosheet transistors in N2. Then there is A16, introduced only last month, that will be ideal for HPC products with complex signal routes and dense power delivery networks.
The competition to produce the world’s most advanced chips is fierce, and TSMC’s product roadmap promises that the battle for supremacy will be intense. First, its performance-optimized N3P node is coming, set to enter mass production in the second half of 2024 and will be the company’s most advanced node for a while.
Next year, however, TSMC will introduce two production nodes that will enter high-volume manufacturing in the second half of 2025, promising to accelerate the advantages of N3P.
