The money will be used to equip operations there with the ability to manufacture “advanced semiconductor packaging technologies,” including Foveros, a 3D packaging technology that allows Intel…
Bottom line: Intel has announced plans to spend $3.5 billion to upgrade one of its chip manufacturing facilities in Rio Rancho, New Mexico. The idea is that the heavy investment will help counter the ongoing global chip shortage, but it’s going to take some time for the money to do its job. The money will be used to equip operations there with the ability to manufacture “advanced semiconductor packaging technologies,” including Foveros, a 3D packaging technology that allows Intel to stack logic chips vertically rather than side-by-side.
