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AMD's 3D Chip-Stacking Can Triple the L3 Cache on a Ryzen Processor

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The company’s ‚3D V-Cache‘ technology promises to help boost the gaming performance on AMD’s Ryzen processors even more.
(Credit: AMD) Next-generation processors from AMD are poised to get even better, thanks to a new 3D chip-stacking technology that can pack even more cache on the CPU. The chip-stacking process, dubbed “3D V-Cache” and introduced at the all-virtual Computex, takes a Ryzen 5900X processor and triples the CPU’s L3 cache from 64MB to 192MB. According to AMD, the improved cache—which temporarily stores instructions for the CPU—can boost the chip’s 1080p gaming processing capabilities by about 15%. As an example, a normal Ryzen 5900X processor can average 184 frames per second on the game Gears 5. The prototype processor, on the other hand, can run the game at 206fps for a 12% improvement. Credit: AMD The stacking works by physically placing one chip die directly over another, which can reduce the communication distance between the components.

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