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TSMC on Tuesday announced plans to establish a European Semiconductor Manufacturing Company (ESMC) joint venture with its partners Bosch, Infineon, and NXP to build a fab near Dresden, Germany. The new 300-mm fab will produce chips on TSMC’s 28/22 nm and 16/12 nm-class process technologies, primarily for automotive and industrial sectors. As the project is planned under the European Chips Act framework, TSMC is set to get subsidies to build it.
The proposed ESMC fab will be located near Dresden, Germany, and is slated to have a monthly production capacity of 40,000 300mm wafer starts per month. The fab is set to use TSMC’s 28 nm family of production nodes, which includes several specialty manufacturing technologies and a 22 nm low-power fabrication process with planar transistors and 16 nm and 12 nm production technologies featuring FinFETs. The fab, which TSMC will operate, will employ about 2,000 workers and engineers.
ESMC intends to start fab construction in the latter half of 2024 and start making its first products there by the end of 2027.
