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Malaysia to build massive chip design park: PM

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Malaysia’s leader on Monday announced plans to build a massive semiconductor design park, aiming to boost the Southeast Asian nation’s role in the global chip industry.
A prominent player in the semiconductor industry for decades, Malaysia accounts for an estimated 13 percent of global back-end manufacturing, according to German tech giant Bosch.
Now it wants to go beyond production and emerge as a chip design powerhouse too, Prime Minister Anwar Ibrahim said Monday.
“I am pleased to announce the largest IC (integrated circuit) Design Park in Southeast Asia, that will house world-class anchor tenants and collaborate with global companies such as Arm,” Anwar said in a speech, referring to the British chip design giant.

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