MediaTek said that the Dimensity 9400 for smartphones offers improved on-device AI processing, native support for tri-fold displays, and enhanced ray tracing for in-game graphics: Technology news
Taiwanese semiconductor maker MediaTek has launched the Dimensity 9400 chipset, bringing improved performance across the board. Notably, the new-generation flagship chip enhances on-device artificial intelligence capabilities and supports tri-fold smartphones. Based on TSMC’s second-generation 3nm process, the Dimensity 9400 chip is up to 40 per cent more power efficient than its predecessor, MediaTek stated.
The company also indicated that the first smartphones powered by the MediaTek Dimensity 9400 chip will be available in the fourth quarter of 2024.
The MediaTek Dimensity 9400 chip has adopted the company’s second-generation All Big Core Design, based on Arm’s v9.2 CPU architecture. The chip features a single Arm Cortex-X925 core operating at a clock speed of over 3.62GHz, coupled with three Cortex-X4 cores and four Cortex-A720 cores. MediaTek claimed that this design offers 35 per cent faster single-core performance and 28 per cent faster multi-core performance compared to the last generation Dimensity 9300 chip.
