Intel says that its latest fab complex will consist of chip packaging facilities and multiple modules that will have the potential of processing wafers by employing its advanced process technologies.
Intel has provided new details regarding its latest fab complex in the United States. Intel CEO Patrick Gelsinger stated that the new fab campus will cost between $60 billion and $120 billion. Gelsinger also stated: By the end of this year, Intel will finalize the location of its upcoming major semiconductor manufacturing hub in the United States as part of its IDM 2.
