Earlier this month, Qualcomm surprised everyone by announcing its latest flagship SoC at the Snapdragon Technology Summit in Hawaii, the Snapdragon 845. Like previous flagship Snapdragon SoCs, the Snapdragon 845 is expected to power the vast majority of Android flagship smartphones next year. As for the mid-range lineup, a new leak from Weibo claims Qualcomm…
Earlier this month, Qualcomm surprised everyone by announcing its latest flagship SoC at the Snapdragon Technology Summit in Hawaii, the Snapdragon 845. Like previous flagship Snapdragon SoCs, the Snapdragon 845 is expected to power the vast majority of Android flagship smartphones next year. As for the mid-range lineup, a new leak from Weibo claims Qualcomm will be releasing three new mid-range SoCs early next year – Snapdragon 670, Snapdragon 640, and the Snapdragon 460.
The most powerful of the three mid-range SoCs from Qualcomm next year will be the Snapdragon 670, successor to this year’s Snapdragon 660. While the Snapdragon 660 is made on a 14nm process node, the Snapdragon 670 is said to use the same 10nm LPP process node as the flagship Snapdragon 845 chipset. This will allow for impressive gains both in terms of performance as well as power efficiency. The octa-core SoC will feature four Kryo 360 Gold cores clocked at 2.0 GHz and four Kryo 385 Silver cores clocked at 1.6 GHz. The leaked spec sheet suggests the Kryo 360 Gold is a derivative of ARM’s Cortex-A75 core while the Kryo 385 Silver is a derivative of ARM Cortex-A55. Powering the graphics will be an Adreno 620 GPU, likely a major upgrade over the Adreno 512 GPU found in the Snapdragon 660. The chip will also come with support for triple-channel LPDDR4x-1866 memory, dual 14-bit Spectra 260 ISP (1x 26MP or 2x 13MP), and Snapdragon X16 LTE modem with download speeds of up to 1000Mbps.
The Snapdragon 640 will succeed the Snapdragon 630 and feature two Kryo 360 Gold cores clocked at 2.15 GHz paired with six Kryo 360 silver cores clocked at 1.55 GHz. It will also feature an Adreno 610 GPU, dual-channel LPDDR4x-1866 memory support, Dual 14-bit Spectra 260 ISP, and the Snapdragon X12 LTE modem with maximum download speeds of up to 600 Mbps. It will be manufactured on a 14nm LPP node by Samsung.
The Snapdragon 460, like the other two upcoming Snapdragon chips, will feature an octa-core design. It will have four Kryo 360 Silver cores clocked at 1.8 GHz and four Kryo 360 Silver cores clocked at 1.4 GHz. As far as the rest of the core specs go, the Snapdragon 460 will be identical to the Snapdragon 640. The only difference will be the ISP. Instead of a dual 14-bit Spectra 260 ISP, the Snapdragon 460 will include a 14-bit Spectra 240 ISP with support for up to 21-megapixel cameras.
