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Samsung is announcing today that it has begun mass production of 12 GB and 16 GB LPDDR5X modules in the industry’s thinnest package. Samsung’s shrunken memory packages measure approximately 0.65 mm in thickness, making them 0.06 mm (~9%) thinner than standard LPDDR5X packages. The company expects the new DRAM devices to be used to make for thinner smartphones, or improve their performance by enabling better airflow inside.
According to the company’s press release, Samsung achieved this ultra-thin design by employing new packaging methods, such as optimized printed circuit boards (PCBs) and epoxy molding compound (EMC). Additionally, an optimized back-lapping process was used to further reduce the height of the packages. The newly developed DRAM packages are not only thinner by 9% compared to previous models but also offer a 21.
