Intel unveiled a lot of details at the Architecture Day held yesterday and one of these juicy details include Foveros – Intel’s new approach to heterogeneous system integration. It’s the spiritual successor to Intel’s EMIB and features an active interposer to “mix and match” pretty much any IP together. The key differentiator here is the…
Intel unveiled a lot of details at the Architecture Day held yesterday and one of these juicy details include Foveros – Intel’s new approach to heterogeneous system integration. It’s the spiritual successor to Intel’s EMIB and features an active interposer to “mix and match” pretty much any IP together. The key differentiator here is the use of an active interposer as opposed to a passive interposer.
So why the need for 3D stacking? Well, as Intel demonstrated in their presentation, no single transistor node works across all types of applications. For iGPU you need minimal leakage with low power and low cost, with dGPU you need a mix of performance, power, and cost while for desktop CPUs you need high performance (at a high cost) and power consumption is tolerated.
