Samsung introduced its newest and most advanced chip packaging technology and service roadmap during the Samsung Foundry Forum 2024 event. According to unnamed industry sources quoted by.
Forward-looking: Major chipmaking companies have been trying to stack different kinds of silicon components onto each other for quite some time. Now, Samsung is apparently ready to debut a significant advancement that integrates logic chips with high-bandwidth RAM.
Samsung introduced its newest and most advanced chip packaging technology and service roadmap during the Samsung Foundry Forum 2024 event. According to unnamed industry sources quoted by the Korea Economy Daily and Samsung’s own statements, the new tech will debut in fourth-gen high-bandwidth memory due out in 2025.
Samsung’s new stacking solution represents a significant advancement in chip design. It is the first 3D packaging technology officially introduced by the world’s largest memory manufacturer and one of the few companies with the expertise and tools required to produce such advanced chips.
