Analyst Ming-Chi Kuo from Tianfeng International has revealed that these new chips for iPhone 17 will be manufactured using TSMC’s N7 process.
Apple is working on self-developed Wi-F 7 chips for its upcoming products, including the highly anticipated iPhone 17 series, set to launch in the second half of 2025.
Analyst Ming-Chi Kuo from Tianfeng International has revealed that these new chips will be manufactured using TSMC’s N7 process, marking a critical step in Apple’s efforts to enhance its ecosystem integration and reduce reliance on third-party suppliers.
Kuo indicates that Apple plans to transition its entire product line to its own Wi-Fi chips within three years. This strategic shift not only aims to lower costs but also to improve the overall integration of Apple’s devices.
