Intel Architecture Day 2020: Tiger Lake, Xe, and SuperFin And, rather than resorting to the maligned «+» nomenclature, we have a new marketing term for the
Posted by Sebastian Peak| Aug 13,2020| Processors, Graphics Cards| 0 Intel held its Architecture Day 2020 this week, with this virtual press event providing some new disclosures as well an update on the progress Intel is making on their “six pillars of technology innovation strategy”. We will look at some of the consumer-focused news in this post, beginning with an update on Intel’s 10nm process. Intel shared details on the advancements made to their 10nm process, which they are calling “the largest single, intranode enhancement in the company’s history”, adding that it delivers a “performance improvement comparable to a full-node transition”. And, rather than resorting to the maligned “+” nomenclature, we have a new marketing term for the advancements to Intel’s 10nm process: SuperFin. After years of refining the FinFET transistor, Intel is redefining the technology to enable the largest single intranode enhancement in its history, delivering performance improvement comparable to a full-node transition.10nm SuperFin technology combines Intel’s enhanced FinFET transistors with Super metal insulator metal capacitor. SuperFin technology offers enhanced epitaxial source/drain, improved gate process and additional gate pitch to enable greater performance by: The first processor family based on SuperFin? Tiger Lake.
