A change in how the chipset stack is layered may lead to a novel way of improving heat dissipation. This week we’ve seen the Exynos 2600 post impressive.
This week we’ve seen the Exynos 2600 post impressive results on Geekbench and 3DMark. Reports from Korea claim that Samsung has developed a cool new trick for this chip – a Heat Pass Block (HPB) that promises to cool the application processor (AP) better than previous approaches.
A “chipset” is just that – several chips, usually arranged in a package-on-package structure, which places the RAM on top of the application processor (this is the silicon die that holds the CPU, GPU, NPU and other components).
