Intel has detailed its architecture roadmap up until 2025 and beyond. It features a new node naming strategy, a transistor architecture, and packaging enhancements under the IDM 2.0 model.
At its Accelerated event, Intel had a bunch of stuff to announce regarding its node naming strategy and architecture roadmap for products that it will power through 2025 and beyond. It has also unveiled its first new transistor architecture in over a decade, and named it RibbonFET. First up is Intel’s new node naming strategy detailed in the roadmap seen above. The company is making these changes to offer customers a vivid view of process nodes as well as establish a consistent framework. Intel 7 – previously known as Enhanced SuperFin – is targeted for Alder Lake in client machines and Sapphire Rapids for data centers. The latter will enter production phase in the first quarter of 2022. Next ups is Intel 4 – previously known as 7nm -, the salient features of which can be seen in the graphic above. Intel 3 will be another incremental upgrade after that and will focus on « power and area improvements ».
