ASUS has introduced its largest Designo Curve display to date that weds style with a sophisticated feature set. The new MX38VQ uses a UWQHD-class (3840×1600) IPS panel and is equipped with a Qi wireless charging pad, as well as a Harman/Kardon-designed audio sub-system. The product will hit the market in the second half of this year and its price will not be very high for its size and features.
ASUS introduced its first Designo-series display eight or nine years ago in an attempt to address customers looking for an elegant design as well as premium specifications. Today, the lineup includes ten 23” to 34” monitors with eye-catching aesthetics that use high-resolution IPS panels and built-in audio co-designed with brands like Bang & Olufsen or Harman/Kardon. The Designo Curve is a relatively new addition to the Designo family as the first monitor in the sub-series was announced in mid-2016. At CES, ASUS introduced the second curved Designo display that will also be the largest monitor in the company’s stylish lineup and among the largest ultra-wide displays on the market in general.
The ASUS Designo Curve MX38VQ is based on a 37.5” IPS panel with a 3840×1600 resolution, a 24:10 aspect ratio and 2300R curvature. The rather distinctive specs of the panel may point to the fact that it was sourced from LG and we already know what it is capable of. The resolution of the display is well suited for displaying UHD content filmed in an aspect ratio of 2.35:1 or 2.40:1 (a lot of movies are shot in such aspect ratios). Like the smaller curved Designo model, the MX38VQ uses a stereo audio sub-system co-designed with Harman/Kardon that features two 8 W speakers and software enhancements. As for connectivity, the new monitor has DisplayPort and HDMI inputs, just like many contemporary products.
One of the main selling points of the new Designo Curve MX38VQ display is a 5W/1A Qi wireless charging pad in the base. So far, only AOC and Samsung have released monitors with Qi charging commercially (the Designo Curve MX34VQ announced last year is still not available) and there are no large high-end displays with this feature on the market right now. Meanwhile, there are tens of smartphones and tablets with integrated Qi wireless charging (including those from ASUS itself, but also from Samsung, Google, HP, Microsoft and other) and there are accessories that enable the tech on devices without integrated support (e.g., on Apple iPhone 6S).
ASUS plans to start selling the Designo Curve MX38VQ in Q3 2017 for $1099, which is considerably lower compared to the current price of the LG38UC99 ( ~$1600 ) that allegedly uses the same panel. The monitor is already listed on the company’s global website, which may indicate that the product will be available rather earlier than later.
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© Source: http://www.anandtech.com/show/11018/asus-announces-designo-curve-mx38vq
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The Investigatory Powers Bill, or ‘Snoopers’ Charter’, is set to undergo a legal challenge if sufficient funds are raised by a new crowdfunding campaign from human rights group Liberty.
The Snoopers’…

© Source: http://www.computing.co.uk/ctg/news/3002189/snoopers-charter-to-be-challenged-by-crowdfunded-legal-action
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Corsair introduced its new Bulldog 2.0 small form-factor HTPC console-like barebones kit at CES. The new Bulldog 2.0 received a new motherboard based on the Intel Z270 PCH with improved features, as well as a new CPU liquid cooling system that is said to be quieter compared to the predecessor. At the same time, the kit retained its visual design and a relatively moderate price point.
Corsair’s Bulldog case blends enthusiast-class performance and features with a living room aesthetics, which is a rather rare combination. The Bulldog chassis can accommodate a mini-ITX motherboard, a full-height graphics card (which is not longer than 300 mm and is not thicker than 90 mm), two liquid cooling systems, a 3.5” HDD, up to three 2.5” storage devices, multiple fans as well as an SFX power supply. At CES Corsair demonstrated its new Bulldog 2.0 barebones kit featuring MSI’s Z270I Gaming Pro Carbon AC motherboard, its own new Hydro H6 SF low-profile cooler as well as the SF600 PSU.
Since the Bulldog 2.0 uses almost the same chassis as the initial product , the key differentiators of the new barebones kit is the mainboard and the LCS. The latter is not yet available separately and the company even has not published its specs. The only thing that Corsair says about the H6 SF is that it is quiet even when it has to cool down an overclocked CPU, which is not really a detailed description. As for the Z270I Gaming Pro Carbon AC motherboard, it comes with an LGA1151 socket supporting both Kaby Lake-S and Skylake-S processors, two DIMM slots for up to 32 GB of DDR4 memory, a PCIe 3.0 x4/NVMe M.2-2280 slot for SSDs and a PCIe x16 slot for graphics cards. The motherboard is equipped with the new ASMedia ASM2142 controller (uses PCIe 3.0 x2 interface and thus provides up to 16 Gbps of bandwidth to two USB 3.1 Gen 2 ports) powering USB 3.1 Gen 2 Type-A/C headers, Intel’s dual-band Wireless-AC 8265 module (Wi-Fi 802.11ac + BT 4.2), Intel’s I219-V Gigabit Ethernet controller, a 7.1-channel Realtek ALC1220-based audio sub-system, SATA connectors and so on.
The motherboard looks to be more advanced than the one installed into the first-gen Bulldog as it is based on the latest Intel Z270 PCH, supports Optane Memory caching, a newer audio codec and an improved USB 3.1 (10 Gbps) controller. If the H6 SF LCS is really quieter than the predecessor, then the Bulldog 2.0 has a nice set of improvements over the first version.
The refined Corsair Bulldog 2.0 barebones kit will be available shortly for $399.99, the price point of the first-gen product. In addition, select PC makers and retailers will offer their PCs based on the Bulldog 2.0 that will cost according to their specifications: The higher-end models will use MSI’s liquid-cooled Hydro GFX GTX 1080 graphics cards along with Intel’s K-processors, whereas more affordable builds will use something less extreme for an SFF system.
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© Source: http://www.anandtech.com/show/11017/corsairs-bulldog-gets-kaby-lake-z270
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Thanks to some sleuthing from various readers, AMD has accidentally let the cat out of the bag with regards to the official Ryzen launch date. While they haven’t specifically given an exact date, the talk to be given by AMD at the annual Game Developer Conference (GDC) says the following:
Join AMD Game Engineering team members for an introduction to the recently-launched AMD Ryzen CPU followed by advanced optimization topics.
From http://schedule.gdconf.com/session/optimizing-for-amd-ryzen-cpu-presented-by-amd
The GDC event runs from February 27 th to March 3 rd , and currently the AMD talk is not on the exact schedule yet, so it could appear any day during the event (so be wary if anyone says Feb 27 th ). At this time AMD has not disclosed an exact date either, but it would be an interesting time to announce the new set of Ryzen CPUs right in the middle of both GDC and Mobile World Congress which is also during that week. It would mean that Ryzen news may end up being buried under other GDC and smartphone announcements.
Then again, the launch could easily be anytime during February – this March 3 rd date only really puts an end-point on the potential range. AMD has stated many times, as far back as August, that Q1 is the intended date for launch to consumers in volume. When we spoke with AMD at CES, nothing was set in stone so to speak, especially clock speeds and pricing, but we are expecting a full launch, not just something official on paper. Ryan will be at GDC to cover this exact talk, and I’ll be at MWC covering that event. Either way, we want to make sure that we are front of the queue when it comes time to disclosing as much information as we can get our hands on ahead of time. Stay tuned!

© Source: http://www.anandtech.com/show/11031/amd-set-to-launch-ryzen-before-march-3rd-meeting-q1-target
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