Samsung Electro-Mechanics is accelerating its efforts in the semiconductor glass substrate market by advancing its equipment procurement and installation activities to September. According to ETNews, it will.
Why it matters: Many believe that glass substrate technology will enable the industry to sustain Moore’s Law beyond 2030, ensuring continuous development without being constrained by process size limitations. Samsung aims to outpace Intel, which has been researching glass substrates for nearly a decade and intends to incorporate them into commercial products by 2030. With its updated timeline, the South Korean conglomerate stands a good chance of launching its products ahead of Intel.
Samsung Electro-Mechanics is accelerating its efforts in the semiconductor glass substrate market by advancing its equipment procurement and installation activities to September. According to ETNews, it will also launch a pilot line for its next-gen packaging in Sejong, South Korea, in the fourth quarter – one quarter ahead of schedule.
Earlier this year, the subsidiary initiated R&D work on glass substrates and started exploring potential use cases.
